Applications of Focused Ion Beam

Some information and images obtained from www.iisb.fraunhofer.de/en/

 

 

 

Rapid IC - Prototyping Failure Analysis

  • Focused Ion Beam (FIB) technology allows for fast failure analysis and circuit modification.
  • FIB provides access to prototyping of microsystems.

Advanced Focused Ion Beam Technology Provides:

  • Local material removal on submicron scale
  • Local deposition of conducting and insulating layers in direct writing mode
  • In situ processing by high resolution secondary electron mapping

Fast Verification of Design Changes:

  • Your new device does not work properly.
    You would like to rapidly correct the design and verify its function before starting a new process.
  • Using your redesign data, within a few hours we modify your circuit by:
    • Cutting metal lines by FIB - milling or gas enhancend etching
    • Rewiring of the device by FIB - deposition of new metal interconnects

Failure Analysis in Multilayer Metallization:

  • Your electrical tests indicate malfunction of your interconnects.
  • Using local cross sectioning and in situ SE (Secondary Electon Imaging) - inspection exactly at the area of interest, the nature of the failure is identified, e.g.voids, cracks, particles, etc.
  • Fabrication of thin lamella by FIB allows TEM (Transmission Electron Microscopy) and high resolution EDX (Electron Diffraction X-ray Spectroscopy) analysis at well defined areas.

Further Applications

  • You need access to buried metal lines for electrical testing.
  • We create additional test pads by local removal of the passivation above metal lines or by deposition of new test pads.
  • Integration of existing optional elements on the chip:
    Different device options already realized for circuit optimization are activated/deactivated by FIB.
  • Fine tuning of analog devices:
    Passive device elements are trimmed by FIB.
  • Prototyping of microsystems:
    Micromachining of actuators, sensors, and microoptics, e.g. fabrication and polishing of optical elements, integration of sensors, fine tuning of cantilevers and tips

Please contact us for more information about the facility.