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PCAMM
Facilities and Capabilities
PCAMM provides surface analysis, materials characterization
and custom
thin film growth for a wide variety of clients, both from within the
three
universities and from other universities as well as from industry and
government.
State of the art capabilities are available for thin film growth and
for
a number of different surface analysis and other materials
characterization
techniques.
Growth and deposition equipment
- MBE (molecular beam epitaxy)
of ultrathin
metallic films, primarily for magnetic applications
- MOCVD
(metalorganic chemical vapour deposition) of III-V compound
semiconductors with emphasis on antimonides, as well as oxide
semiconductors such as ZnO.
- MBE of III-V compound semiconductors and oxide materials
such as YAG thin films for photonic devices.
Microfabrication equipment
- deep uv and electron beam photolithography
- reactive ion etching
- plasma assisted cvd deposition
- sputtering, e-beam and thermal deposition systems
- extensive class 100 and class 10,000 cleanroom facilities
- rapid thermal annealing
Analysis techniques
- SAM - scanning Auger microscopes: SFU, UBC
- STEM - 200 keV
scanning
transmission electron microscope: including
- SEM - scanning
electron microscopes
- SPM - scanning probe microscopes
- AFM - atomic force
microscope
- STM - scanning tunneling microscope
- XRD - high resolution X-ray diffractometers
- XPS - X-ray photoemission
spectrometers: SFU, UBC
- SIMS - secondary ion mass spectrometer
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